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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12227672 B1

PDFFull Text
Date of Patent:
Feb. 18, 2025

Filed:

Dec. 23, 2021

Method for manufacturing a multilayer ceramic capacitor

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Gyun Kwon, Suwon-si, KR;

Eung Seok Lee, Suwon-si, KR;

So Hyeon Hong, Suwon-si, KR;

Byung Rok Ahn, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Paul D Kim

Int. Cl.
CPC ...
H05K 3/30 (2006.01); C09D 5/24 (2006.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); C09D 7/45 (2018.01); C09D 129/04 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C09D 7/20 (2018.01); C09D 7/45 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09D 129/04 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); H01G 4/248 (2013.01);
Abstract

A method for manufacturing a multilayer ceramic capacitor including an operation of preparing a ceramic green sheet; an operation of forming a conductive paste on the ceramic green sheet; an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed; an operation of sintering the ceramic laminate; and an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.

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