The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Oct. 30, 2020
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Fukui, Ichihara, JP;

Kyoko Toyama, Ichihara, JP;

Norihisa Kishimoto, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09C 3/12 (2006.01); C08G 77/18 (2006.01); C08G 77/20 (2006.01); C08K 3/22 (2006.01); C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
C09C 3/12 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08K 3/22 (2013.01); C08K 9/06 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01);
Abstract

An organopolysiloxane is provided. The organopolysiloxane is represented by a general formula. In the general formula, Rare the same or different aliphatic unsaturated monovalent hydrocarbon groups having 2 to 12 carbon atoms, Rs are the same or different monovalent hydrocarbon groups having 1 to 12 carbon atoms and not having an aliphatic unsaturated bond, Rs are the same or different alkyl groups having 1 to 3 carbon atoms, 'n' is an integer of from 1 and 500, and “a” is 0 or 1. A thermally conductive silicone composition having the organopolysiloxane as a component is also provided. The organopolysiloxane can be used as a surface treatment agent for a thermally conductive filler. The organopolysiloxane provides for favorable handling/workability of compositions even if such compositions are highly loaded with a thermally conductive filler.


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