The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Feb. 01, 2022
Applicant:
Kaneka Corporation, Osaka, JP;
Inventors:
Fumiya Kono, Otsu, JP;
Masayoshi Kido, Settsu, JP;
Assignee:
KANEKA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 175/12 (2006.01); C08G 18/10 (2006.01); C08G 18/44 (2006.01); C08G 73/08 (2006.01); C09D 5/44 (2006.01); C09D 125/08 (2006.01);
U.S. Cl.
CPC ...
C08G 18/10 (2013.01); C08G 18/44 (2013.01); C08G 73/08 (2013.01); C09D 5/4449 (2013.01); C09D 125/08 (2013.01); C09D 175/12 (2013.01);
Abstract
A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). Rand Rin formula (1) are each independently a hydrogen atom or a methyl group. Rin formula (1) is a hydrogen atom or any substituent, and a plurality of Rs may be bonded to form a ring structure. Rin formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.