The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Jan. 24, 2022
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventor:
Yosuke Oseki, Tokyo, JP;
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 37/00 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); C08G 77/08 (2006.01); C08G 77/24 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
B29C 37/0075 (2013.01); B32B 7/12 (2013.01); B32B 27/283 (2013.01); C08G 77/08 (2013.01); C08G 77/24 (2013.01); C08J 5/18 (2013.01); B29K 2883/00 (2013.01); B32B 2307/748 (2013.01); C08J 2383/04 (2013.01);
Abstract
A mold release film, including a mold release layer formed by curing a mold release layer composition containing a curable silicone having a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film. In a concentration distribution of fluorine atoms in a thickness direction within the mold release layer, fluorine atoms are unevenly distributed on a surface of the mold release layer, and a fluorine atom concentration on one side of the mold release layer is 39.0 atom concentration % or more.