The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Sep. 22, 2022
Applicant:
Toyama Prefecture, Toyama, JP;
Inventor:
Hideki Yamagishi, Toyama, JP;
Assignee:
TOYAMA PREFECTURE, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/227 (2006.01); B23K 103/20 (2006.01);
U.S. Cl.
CPC ...
B23K 20/023 (2013.01); B23K 20/2275 (2013.01); B23K 2103/20 (2018.08);
Abstract
The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as Tmm, the total thickness thereof after bonding is defined as Tmm, and T/T=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.