The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Jan. 06, 2022
Applicant:

Skyworks Global Pte. Ltd., Singapore, SG;

Inventors:

You Qian, Singapore, SG;

Rakesh Kumar, Singapore, SG;

Guofeng Chen, Fremont, CA (US);

Myeong Gweon Gu, Seoul, KR;

Myung Hyun Park, Seongnam-si, KR;

Jae Hyung Lee, Seoul, KR;

Michael Jon Wurtz, Lake Oswego, OR (US);

Assignee:

Skyworks Global Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/01 (2023.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 17/02 (2006.01); H04R 17/10 (2006.01); H10N 30/30 (2023.01);
U.S. Cl.
CPC ...
H10N 30/01 (2023.02); B81B 3/0021 (2013.01); B81C 1/00134 (2013.01); H04R 17/02 (2013.01); H04R 17/10 (2013.01); H10N 30/302 (2023.02); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

A method of making an acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes forming or providing a mold having one or more grooves in a top surface of the mold that extend in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam, the distal portion of the beam having a corrugated section including one or more grooves that correspond to the grooves of the mold. The method also includes forming a gap in the structure to define two beams separated by the gap, and releasing the structure from the mold to form one or more cantilever beams that increases an acoustic resistance of the gap between sensors.


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