The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Jan. 27, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunjoong Yoon, Suwon-si, KR;

Heesoon Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H01Q 1/24 (2006.01); H04M 1/02 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); G06F 1/1656 (2013.01); G06F 1/1698 (2013.01); H01Q 1/243 (2013.01); H04M 1/0277 (2013.01); H05K 7/20963 (2013.01);
Abstract

An electronic device includes an electronic component on ae printed circuit board, an electrical shield extended around the electronic component and defining an opening corresponding to the electronic component, a heat diffusion pattern on the electronic component, and a shielding sheet which extends across the opening of the electrical shield and commonly overlaps the electronic component, the electrical shield and the heat diffusion pattern. The shielding sheet includes a first heat diffusion member which is inside the opening of the electrical shield and contacts the heat diffusion pattern, and a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the electrical shield and contacts both an upper portion of the electrical shield and the first heat diffusion member.


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