The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Nov. 29, 2021
Applicant:

Essex Furukawa Magnet Wire Japan Co., Ltd., Tokyo, JP;

Inventor:

Keisuke Atsumi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 1/12 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H02G 1/1253 (2013.01); H01F 41/04 (2013.01); Y10T 29/5313 (2015.01);
Abstract

A peeling device for a resin layer coating a rectangular wire in which an outer side of a metal conductor having a rectangular shape in cross section is coated with the resin layer, including a processing blade configured to peel off the resin layer, a jig configured to hold the rectangular wire, and a position detection means configured to detect a position of a cutting edge of the processing blade with respect to a surface of the metal conductor, in which the cutting edge of the processing blade is caused to penetrate into a predetermined thickness position of the resin layer, and the processing blade and the rectangular wire are relatively moved in a longitudinal direction of the rectangular wire without contact of the cutting edge with the metal conductor to perform treatment of peeling off the resin layer.


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