The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Jul. 18, 2022
Applicant:

Aptiv Technologies Ag, Schaffhausen, CH;

Inventors:

Yuxiao He, Carmel, IN (US);

Kenneth Sean Ayotte, Indianapolis, IL (US);

Kevin Paul McReynolds, Noblesville, IN (US);

Assignee:

Aptiv Technologies AG, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 7/00 (2006.01); H01P 3/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 7/00 (2013.01); H01P 3/16 (2013.01); H05K 1/024 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10098 (2013.01);
Abstract

This document describes techniques, apparatuses, and systems for an antenna-to-printed circuit board (PCB) transition. An apparatus (e.g., a radar system) may include an MMIC or other processor to generate electromagnetic signals. The apparatus can include a PCB that includes multiple layers, a first surface, and a second surface that is opposite and in parallel with the first surface. The PCB can also include a dielectric-filled portion formed between the first surface and second surface. The apparatus can also include a conductive loop located on the first surface and connected to a pair of lines. The apparatus can further include a transition channel mounted on the first surface and positioned over the dielectric-filled portion. The described transition can reduce manufacturing costs and board sizes, reduce energy losses, and support a wide bandwidth.


Find Patent Forward Citations

He, Yuxiao. (2025). Antenna-to-printed circuit board transition (U.S. Patent No. 12224502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12224502

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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