The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Mar. 23, 2021
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Kouichirou Sugai, Kyoto, JP;
Kazuki Nishimoto, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/024 (2014.01); H01L 33/64 (2010.01); H01S 5/02315 (2021.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 31/024 (2013.01); H01S 5/02315 (2021.01); H01S 5/02469 (2013.01);
Abstract
An electronic component mounting substrate includes: a metal substrate including a first surface, an insulation substrate including a second surface on which a first metal layer having a frame shape is provided, and a bonding material that bonds the first surface and the first metal layer. The bonding material is located in a region that includes the first metal layer and that is surrounded by the first metal layer in a plane perspective.
Quick Actions:
Sugai, Kouichirou. (2025). Electronic component mounting substrate and electronic device (U.S. Patent No. 12224390). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12224390
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile