The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Dec. 05, 2019
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Ji Wang, Singapore, SG;

Qi Chuan Yu, Singapore, SG;

Kam Wah Leong, Singapore, SG;

Hartmut Rudmann, Jona, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 25/16 (2023.01); H01L 31/173 (2006.01); H01L 33/44 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 25/167 (2013.01); H01L 31/173 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.


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