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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12224373 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Dec. 27, 2021

Micro-led structure and micro-led chip including same

Applicant:

Jade Bird Display (Shanghai) Limited, Shanghai, CN;

Inventors:

Qiming Li, Albuquerque, NM (US);

Yuankun Zhu, Shanghai, CN;

Anle Fang, Shanghai, CN;

Deshuai Liu, Shanghai, CN;

Jian Guo, Shanghai, CN;

Assignee:

JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai, CN;

Attorney:

FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP

Primary Examiner:

Feifei Yeung Lopez

Int. Cl.
CPC ...
H01L 33/06 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/02 (2010.01); H01L 33/04 (2010.01); H01L 33/10 (2010.01); H01L 33/20 (2010.01); H01L 33/24 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/10 (2013.01); H01L 33/20 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01);
Abstract

A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer, at least one part of the light emitting layer being formed between adjacent micro-LEDs. the micro-LED chip further comprises a metal layer formed on the light emitting layer between the adjacent micro-LEDs.

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