The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Jun. 16, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Chan Hoon Ko, Suwon-si, KR;
Sang Hoon Kim, Suwon-si, KR;
Yoong Oh, Suwon-si, KR;
Hea Sung Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49811 (2013.01); H05K 1/111 (2013.01); H01L 23/49822 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/098 (2013.01); H05K 2201/099 (2013.01);
Abstract
A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.