The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Mar. 15, 2021
Applicants:

Beijing Boe Technology Development Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventor:

Hu Meng, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/311 (2006.01); H01L 21/3205 (2006.01); H01L 21/3213 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/02164 (2013.01); H01L 21/0217 (2013.01); H01L 21/02282 (2013.01); H01L 21/288 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/32051 (2013.01); H01L 21/32135 (2013.01); H01L 21/56 (2013.01);
Abstract

A manufacturing method of a metal grid includes: providing a base substrate; forming a pattern including a first dielectric layer on the base substrate through a patterning process such that the first dielectric layer has a first groove in a lattice shape; forming a second dielectric layer on a side of the first dielectric layer away from the base substrate such that the second dielectric layer is deposited at least on a sidewall of the first groove to form a second groove in a lattice shape; and forming a metal material in the second groove, and removing at least a part of a material of the second dielectric layer such that an orthographic projection of the part of the material of the second dielectric layer on the base substrate does not overlap with an orthographic projection of the metal material on the base substrate, to form a metal grid.


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Meng, Hu. (2025). Manufacturing method of metal grid, thin film sensor and manufacturing method of thin film sensor (U.S. Patent No. 12224234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12224234

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