The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Aug. 24, 2021
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Inventor:
Kyo Tanabiki, Himeji Hyogo, JP;
Assignees:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4842 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/49579 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a frame with a die pad and terminals extending from the die pad in a first direction. A groove is provided in an upper surface of the die pad. A semiconductor element is on the upper surface of the die pad but does not overlap the groove. A resin material covers the semiconductor element and is in the groove. The groove includes a bottom surface with an irregularity therein.