The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Aug. 29, 2022
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Chin-Lung Ting, Miao-Li County, TW;
Chung-Kuang Wei, Miao-Li County, TW;
Cheng-Chi Wang, Miao-Li County, TW;
Yeong-E Chen, Miao-Li County, TW;
Yi-Hung Lin, Miao-Li County, TW;
Assignee:
InnoLux Corporation, Miao-Li County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/44 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 23/44 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); H05K 1/0209 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/12041 (2013.01); H05K 2201/064 (2013.01);
Abstract
An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.