The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Nov. 04, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Takafumi Yamamoto, Fukuoka, JP;
Takuya Nomoto, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
According to an aspect of the present disclosure, a semiconductor manufacturing apparatus includes a stage having a mounting region for a wafer on an upper surface, a plurality of sucking pipes extending from the mounting region to a back surface side of the stage through the stage, a vacuum pump that is connected to the plurality of sucking pipes and sucks the wafer onto the mounting region via the plurality of sucking pipes, a cup provided on the upper surface of the stage and covering the wafer, a gas supply line that pressurizes a space surrounded by the upper surface of the stage and the cup and a pressure sensor that detects pressure in the plurality of sucking pipes.