The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
May. 01, 2024
3m Innovative Properties Company, St. Paul, MN (US);
Ankit Mahajan, Cupertino, CA (US);
Saagar A. Shah, Minneapolis, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Kayla C. Niccum, Maplewood, MN (US);
Kara A. Meyers, Oakdale, MN (US);
Matthew R. D. Smith, Woodbury, MN (US);
Gino L. Pitera, St. Paul, MN (US);
Graham M. Clarke, Woodbury, MN (US);
Jeremy K. Larsen, Farmington, MN (US);
Teresa M. Goeddel, St. Paul, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.