The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Nov. 04, 2021
Applicant:

Qromis, Inc., Santa Clara, CA (US);

Inventors:

Vladimir Odnoblyudov, Danville, CA (US);

Cem Basceri, Los Gatos, CA (US);

Shari Farrens, Boise, ID (US);

Assignee:

Qromis, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C30B 29/06 (2006.01); C30B 29/40 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01);
U.S. Cl.
CPC ...
H01L 21/0242 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 29/406 (2013.01); H01L 21/0243 (2013.01); H01L 21/0245 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/0254 (2013.01); H01L 21/84 (2013.01); H01L 27/12 (2013.01); H01L 33/0075 (2013.01); H01L 33/02 (2013.01); C30B 29/403 (2013.01);
Abstract

An engineered substrate structure includes a ceramic substrate having a front surface characterized by a plurality of peaks. The ceramic substrate includes a polycrystalline material. The engineered substrate structure also includes a planarization layer comprising a planarization layer material and coupled to the front surface of the ceramic substrate. The planarization layer defines fill regions filled with the planarization layer material between adjacent peaks of the plurality of peaks on the front surface of the ceramic substrate. The engineered substrate structure further includes a barrier shell encapsulating the ceramic substrate and the planarization layer, wherein the barrier shell has a front side and a back side, a bonding layer coupled to the front side of the barrier shell, a single crystal layer coupled to the bonding layer, and a conductive layer coupled to the back side of the barrier shell.


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