The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Oct. 25, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Chung Yeol Lee, Suwon-si, KR;
Yoo Jeong Lee, Suwon-si, KR;
Hyung Jong Choi, Suwon-si, KR;
Kwang Yeun Won, Suwon-si, KR;
So Jung An, Suwon-si, KR;
Woo Kyung Sung, Suwon-si, KR;
Kang Ha Lee, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
Jong Ho Lee, Suwon-si, KR;
Jun Hyeong Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.