The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Oct. 11, 2021
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Takanori Yoshizawa, Tokyo, JP;

Masanori Okawara, Tokyo, JP;

Hideharu Suzuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 27/255 (2013.01); H01F 27/2828 (2013.01);
Abstract

A coil component includes a core, a conductive wire, and a solder portion. The core includes a mounting surface extending from one end to the other end along a one-axis direction, a recessed portion connected to the one end of the mounting surface in the one-axis direction and recessed from the mounting surface, and an end surface connected to the recessed portion. The conductive wire has one end disposed at the recessed portion. The solder portion is provided at the recessed portion to be electrically connected to one end of the conductive wire. The solder portion includes a peak projecting from the mounting surface, an inner region located farther from the end surface than the peak in the one-axis direction, and an outer region located closer to the end surface than the peak in the one-axis direction and having a larger volume than the inner region.


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