The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Mar. 24, 2021
Applicant:

Shenzhen Sunlord Electronics Co., Ltd., Guangdong, CN;

Inventors:

Yingying Wang, Guangdong, CN;

Xinshu Yu, Guangdong, CN;

Shengcheng Xia, Guangdong, CN;

Youyun Li, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01); H01F 41/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2823 (2013.01); H01F 27/022 (2013.01); H01F 27/29 (2013.01); H01F 41/0246 (2013.01); H01F 41/10 (2013.01);
Abstract

An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.


Find Patent Forward Citations

Loading…