The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Sep. 15, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Shinichi Sato, Tokyo, JP;

Yohei Tadaki, Tokyo, JP;

Akihiko Oide, Tokyo, JP;

Yuma Ishikawa, Tokyo, JP;

Hidekazu Sato, Tokyo, JP;

Kazuhiro Ebina, Tokyo, JP;

Hiroyuki Tanoue, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.


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