The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Feb. 09, 2023
Applicant:
Palo Alto Research Center Incorporated, Palo Alto, CA (US);
Inventors:
Qian Wang, Mountain View, CA (US);
Christopher L. Chua, San Jose, CA (US);
Yu Wang, Union City, CA (US);
Eugene M. Chow, Palo Alto, CA (US);
Assignee:
Xerox Corporation, Orwalk, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/02 (2006.01); H10N 60/80 (2023.01);
U.S. Cl.
CPC ...
H01B 12/02 (2013.01); H10N 60/80 (2023.02);
Abstract
A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.