The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Nov. 23, 2021
Applicant:

Beijing Dream Ink Technologies Co., Ltd., Beijing, CN;

Inventors:

Zhongwei Ren, Beijing, CN;

Jiameng Kang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08L 63/00 (2006.01); C08L 75/08 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08L 63/00 (2013.01); C08L 75/08 (2013.01); H05K 1/092 (2013.01); H05K 3/1283 (2013.01); H05K 3/34 (2013.01); C08K 2003/0806 (2013.01); H05K 2201/032 (2013.01);
Abstract

The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.


Find Patent Forward Citations

Loading…