The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Sep. 08, 2020
Applicant:

Cemecon Ag, Würselen, DE;

Inventors:

Werner Kölker, Herzogenrath, DE;

Stephan Bolz, Aachen, DE;

Oliver Lemmer, Aachen, DE;

Assignee:

CemeCon AG, Würselen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/35 (2006.01); C23C 14/56 (2006.01); C23C 14/58 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/345 (2013.01); C23C 14/022 (2013.01); C23C 14/0652 (2013.01); C23C 14/0664 (2013.01); C23C 14/067 (2013.01); C23C 14/3485 (2013.01); C23C 14/352 (2013.01); C23C 14/56 (2013.01); C23C 14/5833 (2013.01); H01J 37/3405 (2013.01); H01J 37/3467 (2013.01); H01J 2237/332 (2013.01);
Abstract

The invention relates to a method for coating a substrate, a coating system for carrying out the method, and a coated body. In a first method step, the substrateis pretreated in a ion etching process. In a second method step, a first coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the substrateby means of a PVD process. In order to achieve a particularly high-quality and durable coating, the surface of the first coating layeris treated by means of an ion etching process in a third method step, and an additional coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the first coating layerby means of a PVD process in a fourth method step. The coated body comprises at least two coating layerswith a thickness of 0.1 μm to 6 μm on a substrate, wherein an interface region formed by ion etching is arranged between the coating layers


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