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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12221563 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Jan. 28, 2022

Curable composition

Applicant:

Kaneka Corporation, Osaka, JP;

Inventor:

Kiyoshi Miyafuji, Takasago, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:

Osha Bergman Watanabe & Burton LLP

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C09J 171/02 (2006.01); C08F 8/42 (2006.01); C08F 220/14 (2006.01); C08F 220/18 (2006.01); C08F 230/08 (2006.01); C08G 59/24 (2006.01); C08G 59/30 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08G 59/64 (2006.01); C08G 59/68 (2006.01); C08G 65/10 (2006.01); C08G 65/336 (2006.01); C08K 5/544 (2006.01); C08K 5/548 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 171/02 (2013.01); C08F 8/42 (2013.01); C08F 220/14 (2013.01); C08F 220/1808 (2020.02); C08F 230/08 (2013.01); C08F 230/085 (2020.02); C08G 59/245 (2013.01); C08G 59/306 (2013.01); C08G 59/5006 (2013.01); C08G 59/5026 (2013.01); C08G 59/5033 (2013.01); C08G 59/623 (2013.01); C08G 59/64 (2013.01); C08G 59/686 (2013.01); C08G 65/10 (2013.01); C08G 65/336 (2013.01); C08K 5/544 (2013.01); C08K 5/548 (2013.01); C08L 63/00 (2013.01); C09J 163/00 (2013.01); C08L 2205/03 (2013.01);
Abstract

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiRX. Ris a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer (B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).

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