logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12221536 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Mar. 25, 2021

Insulating film, metal-clad laminate member, and rewiring layer

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Cheng Ping Lin, Kyoto, JP;

Toshiyuki Makita, Mie, JP;

Naohito Fukuya, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 15/098 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); B32B 27/42 (2006.01); C08J 5/18 (2006.01); C08L 63/00 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 15/092 (2013.01); B32B 15/098 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08J 5/18 (2013.01); H05K 1/0373 (2013.01); B32B 15/20 (2013.01); B32B 2264/1021 (2020.08); B32B 2264/303 (2020.08); B32B 2270/00 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2433/08 (2013.01); C08J 2471/10 (2013.01); C08L 2201/02 (2013.01); C08L 2203/202 (2013.01); C08L 2205/03 (2013.01);
Abstract

A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).

Find Patent Forward Citations

Quick Actions:

Lin, Cheng. (2025). Insulating film, metal-clad laminate member, and rewiring layer (U.S. Patent No. 12221536). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12221536

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…