The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Jun. 14, 2022
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Yune Kumazawa, Tokyo, JP;

Shunsuke Katagiri, Tokyo, JP;

Takuya Suzuki, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/3415 (2006.01); C08F 22/40 (2006.01); G03F 7/029 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08K 5/3415 (2013.01); C08F 22/40 (2013.01); G03F 7/029 (2013.01); H05K 1/0346 (2013.01);
Abstract

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2):


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