The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Mar. 29, 2019
Applicant:

Yupo Corporation, Tokyo, JP;

Inventors:

Yuta Iwasawa, Ibaraki, JP;

Shunsuke Honda, Ibaraki, JP;

Masahiko Ueno, Ibaraki, JP;

Assignee:

YUPO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/02 (2006.01); B29C 49/24 (2006.01); G09F 3/02 (2006.01); G09F 3/10 (2006.01); C09J 7/35 (2018.01); C09J 7/40 (2018.01);
U.S. Cl.
CPC ...
B29C 49/24 (2013.01); G09F 3/02 (2013.01); G09F 3/10 (2013.01); B29C 49/2408 (2013.01); B29C 2049/24306 (2022.05); C09J 7/35 (2018.01); C09J 7/405 (2018.01); C09J 2203/334 (2013.01); C09J 2301/312 (2020.08); G09F 2003/025 (2013.01); Y10T 428/2817 (2015.01); Y10T 428/2839 (2015.01); Y10T 428/2848 (2015.01);
Abstract

A laminate including at least a heat-sensitive adhesive layer, a substrate layer, and a protective layer in this order, wherein the substrate layer has a thermoplastic resin film, the heat-sensitive adhesive layer contains a higher fatty acid amide, and the protective layer contains a silicone-based release agent. An in-mold label comprising this laminate. A molded body obtained by affixing this in-mold label. An in-mold label in the form of a roll obtained by winding this in-mold label. This invention provides an in-mold label that is less susceptible to dirt and scratches, excellent in decorativeness and visibility, less likely to cause friction when the labels are stacked on each other, and easy to handle, and has strong adhesive strength to a molded body.


Find Patent Forward Citations

Loading…