The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Nov. 30, 2022
Applicants:

Northwestern University, Evanston, IL (US);

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

John A. Rogers, Wilmette, IL (US);

Hui Fang, Urbana, IL (US);

Jianing Zhao, Urbana, IL (US);

Enming Song, Urbana, IL (US);

Yoon Kyeung Lee, Urbana, IL (US);

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/283 (2021.01); A61B 5/03 (2006.01); A61B 5/361 (2021.01); A61N 1/05 (2006.01); G01N 27/414 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
A61B 5/283 (2021.01); A61B 5/031 (2013.01); A61B 5/361 (2021.01); A61N 1/0587 (2013.01); H01L 21/02115 (2013.01); H01L 21/02118 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02258 (2013.01); H01L 21/02271 (2013.01); H01L 21/02282 (2013.01); G01N 27/414 (2013.01);
Abstract

Provided is a long-term implantable electronic device comprising a first thermally oxidized laver from a first substrate, wherein the first thermally oxidized laver forms a first encapsulation laver; an electronic component supported by the first encapsulation laver, wherein the electronic component and the first encapsulation laver have an exposed surface relative to the first encapsulation laver; a barrier laver that covers the first encapsulation laver and the electronic component exposed surface; a second thermally oxidized layer from a second substrate, wherein the second thermally oxidized layer forms a second encapsulation laver, and the second encapsulation laver is in contact with the barrier layer. Each of the first and second encapsulation layers, the barrier layer, and the electronic component are flexible or bendable, so that the long-term implantable electronic device is configured to conformally contact with a curved biological surface.


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