The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Jun. 19, 2019
International Business Machines Corporation, Armonk, NY (US);
Oblesh Jinka, Stamford, CT (US);
Salvatore Bernardo Olivadese, Stamford, CT (US);
Sean Hart, Tarrytown, NY (US);
Nicholas Torleiv Bronn, Long Island City, NY (US);
Jerry M. Chow, White Plains, NY (US);
Markus Brink, White Plains, NY (US);
Patryk Gumann, Tarrytown, NY (US);
Daniela Florentina Bogorin, Syracuse, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.