The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Nov. 22, 2023
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventors:

Sullivan Do, Ypsilanti, MI (US);

Yu Du, Chicago, IL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); B81B 7/02 (2006.01); H04R 1/22 (2006.01); H04R 1/28 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B81B 7/02 (2013.01); H04R 1/222 (2013.01); H04R 1/2896 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.


Find Patent Forward Citations

Do, Sullivan. (2025). Apparatus and method for mems microphone performance via back volume (U.S. Patent No. 12219312). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12219312

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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