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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12219270 B1

PDFFull Text
Date of Patent:
Feb. 04, 2025

Filed:

May. 04, 2023

Image sensing device

Applicant:

Guangzhou Tyrafos Semiconductor Technologies Co., Ltd., Guangzhou, CN;

Inventors:

Ping-Hung Yin, Hsinchu, TW;

Jia-Shyang Wang, Miaoli County, TW;

Yu Hsiang Wang, Hsinchu, TW;

Assignee:

Guangzhou Tyrafos Semiconductor Technologies Co., Ltd., Guangzhou, CN;

Attorney:

Lin & Associates Intellectual Property, Inc.

Primary Examiner:

Twyler L Haskins

Assistant Examiner:

Akshay undefined Trehan

Int. Cl.
CPC ...
H04N 25/10 (2023.01); G06T 3/4015 (2024.01); G06T 5/50 (2006.01); H01L 27/02 (2006.01); H01L 27/146 (2006.01); H04N 7/01 (2006.01); H04N 23/13 (2023.01); H04N 23/45 (2023.01); H04N 23/52 (2023.01); H04N 23/56 (2023.01); H04N 23/70 (2023.01); H04N 23/73 (2023.01); H04N 23/74 (2023.01); H04N 23/741 (2023.01); H04N 23/75 (2023.01); H04N 23/76 (2023.01); H04N 23/80 (2023.01); H04N 23/951 (2023.01); H04N 25/11 (2023.01); H04N 25/13 (2023.01); H04N 25/47 (2023.01); H04N 25/50 (2023.01); H04N 25/533 (2023.01); H04N 25/535 (2023.01); H04N 25/58 (2023.01); H04N 25/583 (2023.01); H04N 25/59 (2023.01); H04N 25/75 (2023.01); H04N 25/77 (2023.01); H04N 25/771 (2023.01); H04N 25/78 (2023.01);
U.S. Cl.
CPC ...
H04N 25/10 (2023.01); G06T 3/4015 (2013.01); G06T 5/50 (2013.01); H01L 27/0255 (2013.01); H01L 27/14605 (2013.01); H01L 27/14612 (2013.01); H01L 27/14643 (2013.01); H04N 7/0127 (2013.01); H04N 23/13 (2023.01); H04N 23/45 (2023.01); H04N 23/52 (2023.01); H04N 23/56 (2023.01); H04N 23/70 (2023.01); H04N 23/73 (2023.01); H04N 23/74 (2023.01); H04N 23/741 (2023.01); H04N 23/75 (2023.01); H04N 23/76 (2023.01); H04N 23/815 (2023.01); H04N 23/951 (2023.01); H04N 25/11 (2023.01); H04N 25/134 (2023.01); H04N 25/135 (2023.01); H04N 25/47 (2023.01); H04N 25/50 (2023.01); H04N 25/533 (2023.01); H04N 25/535 (2023.01); H04N 25/58 (2023.01); H04N 25/583 (2023.01); H04N 25/59 (2023.01); H04N 25/75 (2023.01); H04N 25/77 (2023.01); H04N 25/771 (2023.01); H04N 25/78 (2023.01); G06T 2207/20208 (2013.01); G06T 2207/20221 (2013.01);
Abstract

The present invention relates to an image sensing device comprising: an image sensing array and an image processing circuit. The image sensing array includes sensing units, and the sensing units respectively generate multiple pieces of pixel data. The multiple pieces of pixel data are generated according to different frame rates under different exposure periods, and include a first pixel data of a first subframe and a second pixel data of a second subframe. The first pixel data is generated by exposing a first exposure period for a first frame rate, and the second pixel data is generated by exposing a second exposure period for a second frame rate. The first frame rate is less than the second frame rate. The first exposure period is greater than the second exposure period, and multiple pieces of the second pixel data are generated during one image capturing operation.

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