The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Aug. 12, 2022
Applicant:

Sphere Entertainment Group, Llc, New York, NY (US);

Inventors:

Michael Graae, Brooklyn, NY (US);

Deanan Dasilva, Malibu, CA (US);

Jason Daughenbaugh, Bozeman, MT (US);

Bryan Robertus, Bozeman, MT (US);

Jason Kay, Bozeman, MT (US);

Logan Mcdermot, Marshall, WI (US);

Wayne Hansen, Lodi, WI (US);

Timothy J. Bierman, Windsor, WI (US);

Assignee:

Sphere Entertainment Group, LLC, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/55 (2023.01); H01R 13/6584 (2011.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); H01R 13/6584 (2013.01); H04N 23/57 (2023.01); H01R 2201/18 (2013.01);
Abstract

Disclosed herein is an image sensor package including a printed circuit board, an image sensor electrically coupled to the printed circuit board, a sealing configuration coupled to a front face of the printed circuit board via a first gasket, and a base coupled to a back face of the printed circuit board via a second gasket. Electronic components embedded on the back face of the printed circuit board align with and connect to mating pads surrounding the image sensor on the front face of the printed circuit board. Wire bonds electrically connect the image sensor to the mating pads and the electronic components. The sealing configuration includes a cover attached to a frame surrounding the image sensor. A gap separates the image sensor from abutting the surrounding printed circuit board, which is coupled to the image sensor via the base.


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