The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Sep. 01, 2023
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Han-Min Cho, Gyeonggi-do, KR;

Chan-Gi Park, Gyeonggi-do, KR;

Yeon-Sang Yun, Gyeonggi-do, KR;

Tae-Wook Ham, Gyeonggi-do, KR;

Hei-Seong Kwak, Gyeonggi-do, KR;

Byoung-Il Son, Gyeonggi-do, KR;

Sung-Chul Park, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 5/35 (2015.01); H01Q 21/28 (2006.01); H01R 12/79 (2011.01); H01R 13/66 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 5/35 (2015.01); H01Q 21/28 (2013.01); H01R 12/79 (2013.01); H01R 13/6691 (2013.01); H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/028 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 1/148 (2013.01); H05K 1/18 (2013.01); H05K 7/1427 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/10098 (2013.01);
Abstract

Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.


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