The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Sep. 20, 2022
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Keisuke Fukae, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/00 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 24/05 (2013.01); H01L 29/401 (2013.01); H01L 29/417 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01);
Abstract

The present disclosure provides a chip part. The chip part includes a substrate, a first external electrode, a second external electrode, a capacitor portion, a lower electrode, a capacitive film and an upper electrode. The first external electrode and the second external electrode are disposed on a first main surface of the substrate. The capacitor portion is disposed on the first main surface of the substrate. The lower electrode includes a first body portion and a first peripheral portion integrally drawn out around the capacitor portion from the first body portion. The capacitive film includes a second body portion disposed within the capacitor portion and a second peripheral portion integrally drawn out from the second body portion to the first peripheral portion. The upper electrode is disposed on the capacitive film.


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