The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Aug. 24, 2022
Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventor:

Masayoshi Tagami, Kuwana, JP;

Assignee:

Kioxia Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 25/18 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 23/5226 (2013.01); H01L 24/05 (2013.01); H01L 24/83 (2013.01); H01L 25/18 (2013.01); H10B 43/27 (2023.02); H01L 2224/05557 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08059 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83896 (2013.01);
Abstract

In one embodiment, a semiconductor device includes a first chip including a substrate, a first plug on the substrate, and a first pad on the first plug, and a second chip including a second plug and a second pad under the second plug. The second chip includes an electrode layer electrically connected to the second plug, a charge storage layer provided on a side face of the electrode layer via a first insulator, and a semiconductor layer provided on a side face of the charge storage layer via a second insulator. The first and second pads are bonded with each other, and the first and second plugs are disposed so that at least a portion of the first plug and at least a portion of the second plug do not overlap with each other in a first direction that is perpendicular to a surface of the substrate.


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