The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Apr. 15, 2020
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Kudo, Tokyo, JP;

Miyuki Suzuki, Tokyo, JP;

Shohei Yamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/486 (2013.01); H01L 23/12 (2013.01); H01L 23/5386 (2013.01);
Abstract

A through electrode substrate according to an embodiment of the present disclosure includes a substrate having a first surface, a second surface, and a through-hole that penetrates between the first surface and the second surface and a through electrode disposed inside of the through-hole. The through electrode includes a first portion that closes part of the through-hole adjacent to the first surface and a second portion disposed along the internal surface of the through-hole. The thinnest part of the first portion in a direction perpendicular to the first surface has a thickness of A, the thinnest part of the second portion has a thickness of B, and the diameter of the through-hole on the first surface has a length of C. The relationship A<C<A+B×2 is satisfied.


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