The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Feb. 14, 2024
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Hisato Inokuchi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/02 (2013.01); H01L 23/49517 (2013.01);
Abstract

A semiconductor device with front and back surfaces, and a side surface having first and second sides opposite to each other, and third and fourth sides opposite to each other. The semiconductor device includes a plurality of circuit boards surrounded by the first to fourth sides, the circuit boards each including an insulating board and a conductive plate, a first lead frame including a first terminal portion extending upward and being bent toward the first side, a second lead frame including a second terminal portion extending upward and being bent toward the second side, and a resin-filled portion provided in a first gap between the first terminal portion and the second terminal portion, the resin-filled portion having a concave portion recessed in a direction from the front surface toward the back surface so that an insulating insertion member is inserted into the concave portion.


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