The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Mar. 23, 2022
Denso Corporation, Kariya, JP;
Syuhei Miyachi, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
An electronic device includes a semiconductor device, a wiring board, a heat dissipating member, and a housing. The semiconductor device includes a semiconductor element, a conductive member electrically connected to the semiconductor element, and a resin mold sealing the semiconductor element. The wiring board includes a wiring portion on which the semiconductor device is mounted, and a resist portion disposed around the wiring portion. The heat dissipating member is in thermal contact with at least one of surfaces of the semiconductor device. The housing is in thermal contact with the semiconductor device through the heat dissipating member. Each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile