The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Nov. 05, 2020
Applicant:

J.e.t. Co., Ltd., Okayama, JP;

Inventors:

Atsuo Kimura, Okayama, JP;

Hirofumi Shomori, Okayama, JP;

Assignee:

J.E.T. CO., LTD., Asakuchi-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); H01L 21/30604 (2013.01);
Abstract

A substrate processing apparatus according to the present invention includes: a processing tank that stores a processing liquid and accommodates a plurality of substrates; a bubble forming section that includes a plurality of bubble pipes, wherein each of the plurality of bubble pipes is divided into a tubular first discharge unit and a tubular second discharge unit that is coaxial with the first discharge unit, wherein one end on a divided side of the first discharge unit and one end on the divided side of the second discharge unit is closed and a plurality of gas discharge holes are formed on the first and second discharge units, and the plurality of bubble pipes are disposed at an interval in a horizontal direction orthogonal to the arrangement direction below the plurality of substrates to be accommodated in the processing tank; and a plurality of flow rate adjustment units that are provided corresponding to each of the first discharge units and each of the second discharge units and independently adjust flow rate of an inert gas.


Find Patent Forward Citations

Kimura, Atsuo. (2025). Substrate processing apparatus (U.S. Patent No. 12217983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12217983

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…