Semiconductor manufacturing system, method of manufacturing a semiconductor device, and semiconductor device

Abstract

A semiconductor manufacturing system includes a calculation unit that calculates an inclination degree of an incidence direction of an etchant in an etching device according to a worn state of a part of the etching device. A correction unit corrects a second exposure pattern so that an edge position in the second exposure pattern including an edge is shifted from a first exposure pattern according to the calculated inclination degree. An exposure device exposes a second resist film formed on the substrate from which a first resist pattern is removed with the second exposure pattern. A development device develops the second resist film and forms a second resist pattern on the substrate. The etching device performs etching processing on the substrate by using the second resist pattern as a mask.