The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Aug. 06, 2020
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Hossein Sadeghi, San Jose, CA (US);

Richard A. Gottscho, Pleasanton, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/04 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); B01D 53/04 (2013.01); B01D 53/0407 (2013.01); B01D 53/0438 (2013.01); B01D 53/0446 (2013.01); H01J 37/32522 (2013.01); H01J 37/32568 (2013.01); H01J 37/32816 (2013.01); B01D 2256/10 (2013.01); B01D 2259/40096 (2013.01); H01J 2237/002 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01);
Abstract

A sorption structure used in a plasma process chamber includes an inner layer having one or more heating elements to heat the sorption structure, a middle section having a lattice structure and a coolant flow delivery network through which a coolant circulates to cool the sorption structure, and a vacuum flow network that is connected to a vacuum line to create low pressure vacuum. The lattice structure includes network of openings defined in a plurality of layers. The inner layer is disposed adjacent to the middle section and an outer layer of the lattice structure faces an interior region of the chamber. The openings in the layers of the lattice structure progressively increase in size from the inner layer to the outer layer. The lattice structure is used to adsorb by-products released in the process chamber and the vacuum flow network is used to remove the by-products.


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