The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Oct. 25, 2023
Applicant:

Cirrus Logic International Semiconductor Ltd., Edinburgh, GB;

Inventors:

Aleksey Khenkin, Lago Vista, TX (US);

David Patten, Austin, TX (US);

Jun Yan, Austin, TX (US);

Assignee:

Cirrus Logic, Inc., Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 17/00 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/08 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 41/08 (2013.01);
Abstract

A method for constructing a solenoid inductor of an IC package with active/passive devices includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.


Find Patent Forward Citations

Loading…