The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Nov. 04, 2020
Applicant:

Alibaba Group Holding Limited, Grand Cayman, KY;

Inventors:

Dimin Niu, Sunnyvale, CA (US);

Tianchan Guan, Shanghai, CN;

Hongzhong Zheng, Los Gatos, CA (US);

Shuangchen Li, Sunnyvale, CA (US);

Assignee:

Alibaba Group Holding Limited, Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/10 (2006.01); G11C 7/04 (2006.01);
U.S. Cl.
CPC ...
G06F 11/1044 (2013.01); G11C 7/04 (2013.01);
Abstract

A system-in-package including a logic die and one or more memory dice can include a reliability availability serviceability (RAS) memory management unit (MMU) for memory error detection, memory error prediction and memory error handling. The RAS MMU can receive memory health information, on-die memory error information, system error information and read address information for the one or more memory dice. The RAS MMU can manage the memory blocks of the one or more memory dice based on the memory health information, on-die memory error type, system error type and read address. The RAS MMU can also further manage the memory blocks based on received on-die memory temperature information and or system temperature information.


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