The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Sep. 10, 2019
Applicant:
Byd Company Limited, Shenzhen, CN;
Inventors:
Junlan Lian, Shenzhen, CN;
Hongye Lin, Shenzhen, CN;
Fan Chen, Shenzhen, CN;
Weitu Li, Shenzhen, CN;
Assignee:
BYD COMPANY LIMITED, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); B29C 45/14 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01); C23C 18/31 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1689 (2013.01); B29C 45/14778 (2013.01); C23C 18/31 (2013.01); B29K 2705/00 (2013.01); B29L 2031/34 (2013.01);
Abstract
A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.
Quick Actions:
Lian, Junlan. (2025). Metal resin composite, preparation method thereof, and electronic product housing having the same (U.S. Patent No. 12215424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12215424
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile