The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Sep. 05, 2023
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

James A. Demuth, Woburn, MA (US);

Andrew J. Bayramian, Marblehead, MA (US);

Eric B. Duoss, Danville, CA (US);

Joshua D. Kuntz, Livermore, CA (US);

Christopher M. Spadaccini, Oakland, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/273 (2017.01); B22F 10/10 (2021.01); B22F 10/28 (2021.01); B22F 10/362 (2021.01); B22F 10/366 (2021.01); B22F 12/00 (2021.01); B23K 26/0622 (2014.01); B23K 26/066 (2014.01); B23K 26/342 (2014.01); B29C 64/153 (2017.01); B29C 64/282 (2017.01); B29C 64/286 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/273 (2017.08); B22F 10/28 (2021.01); B22F 12/00 (2021.01); B23K 26/0622 (2015.10); B23K 26/066 (2015.10); B23K 26/342 (2015.10); B29C 64/153 (2017.08); B29C 64/282 (2017.08); B29C 64/286 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B22F 10/10 (2021.01); B22F 10/362 (2021.01); B22F 10/366 (2021.01); B33Y 50/02 (2014.12); Y02P 10/25 (2015.11);
Abstract

The present disclosure relates to a method involving a substrate having an interface layer, wherein the interface layer (IL) forms only an upper surface portion of the substrate, and a feedstock material (FM) placed on the IL. The method involves using a laser system to generate first and second beam components providing first and second power flux levels, respectively, where the second level is greater than the first. The FM is heated to a first level short of a melting point using the first beam component, at which point the particles of the FM begin to experience surface tension forces relative to the IL. Further heating the FM to a second level melts the FM and also melts the IL of the substrate, but where a portion of the IL remains unmelted by the second beam component as the particles of the FM and the IL are bonded together.


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