The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Apr. 27, 2022
Applicant:
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Inventors:
Arman Boromand, Issaquah, WA (US);
Andrew John Ouderkirk, Kirkland, WA (US);
Sheng Ye, Redmond, WA (US);
Christopher Yuan Ting Liao, Seattle, WA (US);
Assignee:
Meta Platforms Technologies, LLC, Menlo Park, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 55/14 (2006.01); B29C 43/00 (2006.01); B29C 43/24 (2006.01); B29C 55/00 (2006.01); B29K 23/00 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 55/14 (2013.01); B29C 43/003 (2013.01); B29C 43/24 (2013.01); B29C 55/005 (2013.01); B29K 2023/0658 (2013.01); B29L 2007/008 (2013.01);
Abstract
A method includes applying a stress to a polymer thin film to stretch the polymer thin film along a first in-plane direction, and subsequently applying a stress to the polymer thin film to stretch the polymer thin film along a second in-plane direction orthogonal to the first in-plane direction to form an ultra-high modulus polymer thin film. Calendaring or hot pressing of the ultra-high modulus polymer thin film may improve its optical and/or thermal properties.