The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
May. 15, 2020
Applicant:
University of Pittsburgh—of the Commonwealth System of Higher Education, Pittsburgh, PA (US);
Inventors:
Louis D. Falo, Jr., Wexford, PA (US);
Emrullah Korkmaz, Pittsburgh, PA (US);
Assignee:
University of Pittsburgh—Of the Commonwealth System of Higher Education, Pittsburgh, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/44 (2006.01); A61M 37/00 (2006.01); B29C 33/38 (2006.01); B29C 33/40 (2006.01); B29C 33/50 (2006.01); B29K 105/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); B29C 33/3835 (2013.01); B29C 33/3842 (2013.01); B29C 33/3857 (2013.01); B29C 33/3878 (2013.01); B29C 33/405 (2013.01); B29C 33/50 (2013.01); A61M 2037/0023 (2013.01); A61M 2037/0053 (2013.01); B29K 2105/0035 (2013.01); B29K 2995/006 (2013.01); B29K 2995/0062 (2013.01); B29L 2031/7544 (2013.01); B29L 2031/756 (2013.01);
Abstract
The disclosed methods relate to forming microneedle arrays from a production mold that comprises a flexible mold material. The disclosed methods can be used to reproducibly manufacture undercut dissolvable and coated microneedle arrays with various shapes and structures.